High-Precision PCB Circuit Board Manufacturers & Prototype PCBA

4-layer board

6-layer board

8-layer board

4-layer board structure

PCB board thickness: 0.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2313	0.095mm
L2/L3		Core board:	Copper content 1/1	0.3mm
		PP adhesive:	2313	0.095mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 0.6mm ± 0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	5.34mil	/
		90	6mil	10mil
		90	5.2mil	6.3mil
		100	4.7mil	9.8mil
		100	3.9mil	5.6mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	4mil	/
		90	4.5mil	8.5mil
		90	3.9mil	5.1mil
		100	3.7mil	10.3mil
		100	3mil	5.5mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 0.8mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content H/H	0.3mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 0.8mm ± 0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	7.5mil	/
		90	6.8mil	6.2mil
		90	5mil	4mil
		100	5.8mil	8.2mil
		100	4mil	4.5mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 1.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content H/H	0.5mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.0mm ± 0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	9mil	/
		90	7mil	6mil
		90	5mil	4mil
		100	6.3mil	7.7mil
		100	4.1mil	4.4mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 1.2mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content H/H	0.7mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.2mm ± 0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	9.74mil	/
		90	7.2mil	5.8mil
		90	5.2mil	3.8mil
		100	6.3mil	7.7mil
		100	4.1mil	4.4mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 1.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content H/H	1.1mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness:1.6MM/±10%mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	10.5mil	/
		90	7.2mil	5.8mil
		90	5.2mil	3.8mil
		100	6.3mil	7.7mil
		100	4.2mil	4.3mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness:2.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 0.5 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content H/H	1.5mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness：2.0MM/±0.20mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	10.5mil	/
		90	7.2mil	5.8mil
		90	5.2mil	3.8mil
		100	6.3mil	7.7mil
		100	4.2mil	4.3mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 0.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content 1/1	0.3mm
		PP adhesive:	2116	0.125mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.6mm ± 10%mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	7.55mil	/
		90	7.5mil	8.5mil
		90	6.3mil	5.2mil
		100	6mil	8.5mil
		100	4.6mil	4.9mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	4mil	/
		90	4.5mil	8.5mil
		90	3.5mil	5.5mil
		100	3.5mil	10.5mil
		100
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 0.8mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content 1/1	0.3mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 0.8mm/±0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	6mil	/
		90	5.6mil	7.4mil
		90	4.2mil	4.8mil
		100	4.8mil	9.2mil
		100	3.2mil	5.3mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 1.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content 1/1	0.5mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.0mm/±0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	8mil	/
		90	6.2mil	6.8mil
		90	4.4mil	4.6mil
		100	5.3mil	8.7mil
		100	3.3mil	5.2mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 1.2mm
Outer copper thickness: 1oz Inner copper thickness: 1oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content 1/1	0.7mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.2MM/± 0.1mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP Reference L2 BOTTOM Reference L3	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 reference L1&L3 L3 reference L4&L2	50	8.9mil	/
		90	6.2mil	6.8mil
		90	4.4mil	4.6mil
		100	5.4mil	8.6mil
		100	3.4mil	5.1mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness: 1.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content 1/1	1.1mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 1.6mm ± 10%mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	10.3mil	/
		90	6.2mil	6.8mil
		90	4.4mil	4.6mil
		100	5.4mil	8.6mil
		100	3.4mil	5.1mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

PCB board thickness: 2.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness: 1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	7628	0.2mm
L2/L3		Core board:	Copper content 1/1	1.5mm
		PP adhesive:	7628	0.2mm
L4		Copper thickness:	H	0.0175mm
Finished product thickness: 2.0mm/±0.20mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L3)	50	13mil	/
		90	10mil	6mil
		90	7.5mil	4mil
		100	8mil	6.5mil
		100	5.5mil	4mil
L2/L3	L2 refers to L1 & L3 L3 refers to L4 & L2	50	9.5mil	/
		90	6.2mil	6.8mil
		90	4.4mil	4.6mil
		100	5.4mil	8.6mil
		100	3.4mil	5.1mil
Impedance Calculation Parameters: A. PP Dielectric Constant (PP Type: 7628/1080/2313/2116, Dielectric Constant: 4.2) B. Board Dielectric Constant: 4.2 C. Solder Mask Thickness Parameters (Solder mask on substrate: 0.8mil, solder mask on copper foil: 0.6mil, Solder mask dielectric constant: 3.5)

6-layer board structure

PCB board thickness:1.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content 1/1	0.2mm
		PP adhesive:	2116*2	0.25mm
L4/L5		Core board:	Copper content 1/1	0.2mm
		PP adhesive:	2116	0.125mm
L6		Copper thickness:	H	0.0175mm
Finished product thickness: 1.0MM/± 10% mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L5)	50	7.5mil	/
		90	5.6mil	4.4mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L4	L3 refers to L2 & L5 L4 refers to L2 & L5	50	5.5mil	/
		90	5.5mil	8.5mil
		90	4mil	5mil
		100	3.2mil	5.8mil
		100	4.5mil	10.5mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness：1.2mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content 1/1	0.3mm
		PP adhesive:	2116*2	0.25mm
L4/L5		Core board:	Copper content 1/1	0.3mm
		PP adhesive:	2116	0.125mm
L6		Copper thickness:	H	0.0175mm
Finished product thickness: 1.2MM/± 10% mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L5)	50	7.5mil	/
		90	5.7mil	4.3mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.7mil	5.3mil
L3/L4	L3 refers to L2 & L5 L4 refers to L2 & L5	50	10mil	/
		90	7mil	7mil
		90	4.5mil	4.5mil
		100	3.7mil	5.3mil
		100	6.2mil	8.8mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness:1.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content 1/1	0.5mm
		PP adhesive:	2116*2	0.25mm
L4/L5		Core board:	Copper content 1/1	0.5mm
		PP adhesive:	2116	0.125mm
L6		Copper thickness:	H	0.0175mm
Finished product thickness: 1.6MM/± 10% mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L5)	50	7.5mil	/
		90	5.6mil	4.4mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L4	L3 refers to L2 & L5 L4 refers to L2 & L5	50	18mil	/
		90	7.9mil	6.1mil
		90	4.8mil	4.2mil
		100	4mil	5mil
		100	7.2mil	7.8mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness：2.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content 1/1	0.7mm
		PP adhesive:	2116*2	0.25mm
L4/L5		Core board:	Copper content 1/1	0.7mm
		PP adhesive:	2116	0.125mm
L6		Copper thickness:	H	0.0175mm
Finished product thickness:2.0MM/±10%mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP (Refer to L2) BOTTOM (Refer to L5)	50	7.5mil	/
		90	5.6mil	4.4mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L4	L3 refers to L2 & L5 L4 refers to L2 & L5	50	25mil	/
		90	8.1mil	5.9mil
		90	6.2mil	4.8mil
		100	7.2mil	7.3mil
		100	3.8mil	4.7mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

8-layer board structure

PCB board thickness：1.2mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content	0.2mm
		PP adhesive:	1080*2	0.16mm
L4/L5		Core board:	Copper content	0.2mm
		PP adhesive:	1080*2	0.16mm
L6/L7		Core board:	Copper content	0.2mm
		PP adhesive:	2116	0.125mm
L8		Copper thickness:	H	0.0175mm
Finished product thickness:1.2MM/±0.10mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP Reference L2 BOTTOM Reference L7	50	7.5mil	/
		90	5.7mil	4.3mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L6	L3 reference L2&L4 L6 reference L5&L7	50	3.46mil	/
		90	3.3mil	5.7mil
		90	4mil	8mil
		100	3.2mil	10.8mil
		100	3mil	9mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness：1.6mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content	0.3mm
		PP adhesive:	2116+1080	0.2mm
L4/L5		Core board:	Copper content	0.3mm
		PP adhesive:	2116+1080	0.2mm
L6/L7		Core board:	Copper content	0.3mm
		PP adhesive:	2116	0.125mm
L8		Copper thickness:	H	0.0175mm
Finished product thickness:1.6MM/±0.10mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP Reference L2 BOTTOM Reference L7	50	7.5mil	/
		90	5.7mil	4.3mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L6	L3 reference L2&L4 L6 reference L5&L7	50	5.83mil	/
		90	4.1mil	4.9mil
		90	5.3mil	6.7mil
		100	3.4mil	5.8mil
		100	3.7mil	6.4mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

PCB board thickness：2.0mm
Outer copper layer thickness: 1 oz Inner copper layer thickness:1 oz
L1		Copper thickness:	H	0.0175mm
		PP adhesive:	2116	0.125mm
L2/L3		Core board:	Copper content	0.4mm
		PP adhesive:	2116*2	0.25mm
L4/L5		Core board:	Copper content	0.4mm
		PP adhesive:	2116*2	0.25mm
L6/L7		Core board:	Copper content	0.4mm
		PP adhesive:	2116	0.125mm
L8		Copper thickness:	H	0.0175mm
Finished product thickness:2.0MM/±0.10mm
Recommended impedance linewidth
Impedance layer	Reference layer	OHM	Line width mil	Line spacing mil
TOP/BOTTOM	TOP Reference L2 BOTTOM Reference L7	50	7.55mil	/
		90	5.7mil	4.3mil
		90	7.5mil	8.5mil
		100	4mil	4mil
		100	4.8mil	5.2mil
L3/L6	L3 reference L2&L4 L6 reference L5&L7	50	8.5mil	/
		90	4.7mil	4.8mil
		90	5.9mil	6.1mil
		100	3.2mil	4.8mil
		100	4.1mil	5.9mil
Impedance calculation parameters A. PP dielectric constant (PP model: 7628/1080/2313/216, dielectric constant: 4.2) B. Dielectric constant of the board: 4.2 C. Solder mask thickness parameters (solder mask on substrate: 0.8mil, solder mask on copper foil surface: 0.6mil, solder mask dielectric constant: 3.5)

Layered structure

4-layer board

6-layer board

8-layer board

4-layer board structure

6-layer board structure

8-layer board structure