| Project Name (Craft/Process) | Extreme capabilities (template) | Maximum capacity (batch) |
◆ Material Type | ||
| Types of materials used in HDI boards: | RCC (65T & 100T), LDPP (IT-180A1037 and 1086), ordinary PP106 and 1080 | RCC (65T & 100T), LDPP (IT-180A1037 and 1086), ordinary PP106 and 1080 |
| High Tg FR4 (halogen-free) | Shengyi S1165, Kingboard HF-170 | Shengyi S1165, Kingboard HF-170 |
| Standard Tg FR4 (halogen-free) | Shengyi S1155, KB-6165G | Shengyi S1155, KB-6165G |
| High CTI | Shengyi S1600L, KB6165GC, KB-6169GT | Shengyi S1600L, KB6165GC, KB-6169GT |
| High Tg FR4 | FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, IT180A, IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron6 (Panasonic); EM-827 (Taiguang); GA-170 (Hongren); NP-180 (Nanya); TU-752, TU-662 (Taiyao); TU-872, MCL-BE-67G(H), MCL-E-679(W), MCL-E-679F(J) (Hitachi) | FR408, FR408HR, IS410, FR406, GETEK, PCL-370HR; S1000-2, IT180A, IT-150DA; N4000-13, N4000-13EP, N4000-13SI, N4000-13EP SI; Megtron4, Megtron6 (Panasonic); EM-827 (Taiguang); GA-170 (Hongren); NP-180 (Nanya); TU-752, TU-662 (Taiyao); TU-872, MCL-BE-67G(H), MCL-E-679(W), MCL-E-679F(J) (Hitachi) |
| Ceramic powder filled high-frequency material | Rogers 4 series (RO4350B, RO4003, RO4725, RO4730), Shengyi (SJ9033, SJ9036) | Rogers 4 series (RO4350B, RO4003, RO4725, RO4730), Shengyi (SJ9033, SJ9036) |
| Ceramic prepreg | RO4450T/F, SJ930B, SJ936B | RO4450T/F, SJ930B, SJ936B |
| PTFE high-frequency material | Rogers (Arlon) series, Taconic series, Taizhou Wangling F4BM/TP series, Shengyi, Guoneng, Ruilong, Zhongying, Jiuyue | Rogers (Arlon) series, Taconic series, Taizhou Wangling F4BM/TP series, Shengyi, Guoneng, Ruilong, Zhongying, Jiuyue |
| PTFE prepreg | Rogers 6700, Taconic FR-28, RT6002 | Rogers 6700, Taconic FR-28, RT6002 |
| Mixed material lamination | Rogers (Arlon), Taconic, Nelco, Shengyi SJ and FR-4 (including RO4350 partial lamination) | Rogers (Arlon), Taconic, Nelco, Shengyi SJ and FR-4 (including RO4350 partial lamination) |
| Standard FR4 | Shengyi S1141, S1000H, Lianmao IT158, Kingboard KB-6160, KB-6165 | Shengyi S1141, S1000H, Lianmao IT158, Kingboard KB-6160, KB-6165 |
◆ Product Type | ||
| Rigid board | Backplane, HDI, multilayer buried and blind vias, embedded copper blocks, thick copper power layers, back drilling, stepped grooves, metal edging, countersunk holes, POFV, controlled depth drilling | Backplane, HDI, multilayer buried and blind vias, thick copper power planes, back drilling, stepped grooves, metal edging, countersunk holes, POFV, controlled depth drilling, embedded copper blocks |
| Blind and buried via board type | Lamination on the same side ≤ 3 times | Lamination on the same side ≤ 3 times |
◆ Stacking Method | ||
| HDI board type | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated and filled. | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 (buried holes in n ≤ 0.3mm), laser blind holes can be plated and filled. |
◆ Surface treatment | ||
| Types: | Lead-free (or leaded) solder plating, electroplated nickel-gold (copper base thickness ≤ 2 oz), immersion gold (ENIG), immersion tin, electroplated tin, immersion silver, OSP, hard gold plating (with/without nickel), soft gold plating (with/without nickel), ENIG+OSP, ENIG+G/F, full board nickel-gold plating + G/F, immersion silver + G/F, immersion tin + G/F, electroless nickel palladium gold (ENEPIG) | Lead-free (or leaded) tin plating, Nickel-gold plating (copper base thickness ≤ 1 oz), Electroless Nickel Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP, Hard Gold Plating (with/without nickel), Soft Gold Plating (with/without nickel), ENIG+OSP, ENIG+G/F, Full board nickel-gold plating + G/F, Immersion Silver + G/F, Immersion Tin + G/F, Electroless Nickel Palladium Immersion Gold (ENEPIG) |
| Tin plating | 1-40um (0.4um for leaded solder plating on large tin areas, 1.5um for lead-free solder plating on large tin areas) | 1-40um (0.4um for leaded tin plating on large tin areas, 1.5um for lead-free tin plating on large tin areas) |
| Copper-nickel-gold plating | Nickel thickness: ≥3um; Gold thickness: 0.025-0.1um | Nickel thickness: ≥3um; Gold thickness: 0.025-0.1um |
| Immersion gold | Nickel thickness: 3-8um; Gold thickness: 0.025-0.075um | Nickel thickness: 3-8um; Gold thickness: 0.025-0.075um |
| Immersion tin | 0.8-1.5um | 0.8-1.5um |
| Electroplated tin | 2-10um | 2-10um |
| Immersion silver | 0.1-0.4um | 0.2-0.4um |
| Silver plating | 0.1-5um | 0.1-5um |
| OSP (Organic Solderability Preservative) | 0.2-0.4um | 0.2-0.4um |
| Hard gold plating (containing cobalt) | 0.05-4.0um | 0.05-4.0um |
| Soft gold plating | 0.05-2.0um | 0.05-2.0um |
| Electroless nickel palladium gold | Nickel: 3-8um Palladium: 0.05-0.15um Gold: 0.05-0.1um | Nickel: 3-8um Palladium: 0.05-0.15um Gold: 0.05-0.1um |
◆ Solder mask thickness | ||
| Carbon oil | 8-20 μm | 8-20 μm |
| Green oil | 10-18 μm (solder mask on copper surface), 5-8 μm (solder mask in vias), ≥5 μm at circuit corners (single printing, copper thickness below 48 μm) | 10-18 μm (solder mask on copper surface), 5-8 μm (solder mask in vias), ≥5 μm at circuit corners (single printing, copper thickness below 48 μm) |
| Blue gel | 0.20-0.80 mm | 0.20-0.80 mm |
◆ Standard Hole | ||
| Mechanical hole diameter (finished product) | 0.125-6.5mm (corresponding drill bit thickness is 0.15-6.5mm) | 0.125-6.5mm (corresponding to a drill bit of 0.15-6.5mm) |
| A. PTFE material and mixed pressure with a minimum finished hole diameter of 0.2mm (corresponding to a drilling tool diameter of 0.25mm) | A. PTFE material and mixed pressure with a minimum finished pore size of 0.3mm (corresponding to a drilling tool of 0.35mm) | |
| B. Mechanical blind hole diameter ≤ 0.30mm (corresponding to drill tool ≤ 0.40mm) | B. Mechanical blind hole diameter ≤ 0.30mm (corresponding to drill tool ≤ 0.40mm) | |
| C. Disk hole green oil plug hole drilling diameter ≤ 0.55mm (corresponding to drill bit 0.6mm) | C. Disk hole green oil plug hole drilling diameter ≤ 0.55mm (corresponding to drill bit 0.6mm) | |
| D. The minimum diameter of the connecting hole is 0.35mm (corresponding to a drilling tool of 0.4mm) | D. The minimum diameter of the connecting hole is 0.4mm (corresponding to a drill bit diameter of 0.45mm) | |
| E. Metallized semi porous finished product with a minimum diameter of 0.30mm (corresponding to a drilling tool diameter of 0.35mm) | E. Metallized semi porous finished product with a minimum diameter of 0.30mm (corresponding to a drilling tool diameter of 0.40mm) | |
| Electroplated hole filling laser blind hole diameter | 0.075-0.20mm (preferably 0.1mm) | 0.1-0.15mm (preferably 0.1mm) |
| The maximum thickness to diameter ratio of electroplating filled holes and blind holes | 1: 1 (Depth is the thickness containing copper) | 1: 1 (Depth is the thickness containing copper) |
| Minimum line width/spacing of electroplating filling layer | 3/3mil (line to line); 3/3mil (line to disk, disk to disk) | 3/3.5mil (line to line); 3/3mil (line to disk, disk to disk) |
| The number of times the electroplated filling plate is pressed together | ≤ 3 times | ≤ 3 times |
| Relationship between mechanical drilling aperture and plate thickness | 0.15mm (plate thickness ≤ 1.6mm) | 0.15mm (plate thickness ≤ 1.2mm) |
| Maximum thickness to diameter hole ratio of through-hole plate: 20:1 (when the tool diameter is greater than 0.2mm) | The maximum thickness diameter hole ratio of through-hole plate is 12:1 (when the tool diameter is greater than 0.2mm) (when the tool diameter is 0.2mm, it is 10:1) | |
| Hole accuracy tolerance (compared to CAD data) | ±2.5mil | ±3mil |
| PTH aperture tolerance | ±3mil | ±3mil |
| Solder free device (crimping hole) aperture | ±2mil | ±2mil |
| NPTH aperture tolerance | ± 2mil (limit+0/-2mil or+2/-0mil) | ±2mil |
| The finished pore size range of resin plug holes | 0.1-0.9mm (corresponding to drilling hole 0.15-1.0mm) (drilling hole diameter>0.6mm, plate thickness ≥ 0.5mm) | 0.1-0.9mm (corresponding to drilling hole 0.15-1.0mm) (drilling hole diameter>0.6mm, plate thickness ≥ 0.5mm) |
| Maximum thickness to diameter ratio of resin plug hole (plate thickness/drilling hole) | 20:01 | 12:01 |
| Minimum line width/spacing of resin plug holes | 3/4mil (line to line); 3/3.5mil (line to disk, disk to disk) | 3/4mil (line to line); 3/3.5mil (line to disk, disk to disk) |
| Laser drilling with the smallest aperture | 0.075mm (maximum depth to aperture ratio ≤ 1.2:1) | 0.10mm (maximum depth to aperture ratio ≤ 1:1) |
| Mechanical controlled deep drilling for blind holes with maximum depth to aperture ratio | 1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm) | 1.3:1 (aperture ≤ 0.20mm), 1.15:1 (aperture ≥ 0.25mm) |
| Mechanical controlled deep drilling (back drilling) with minimum depth | 0.1mm | 0.1mm |
| Back drilling diameter | 0.4-6.5mm | 0.4-6.5mm |
◆ Thickness of the interlayer insulation layer between back-drilled layers (target layer and the next layer) | ||
| Thickness of interlayer insulation layer for back drilling | ≥0.15mm | ≥0.15mm |
| Backdrilling depth accuracy tolerance | ±0.075mm | ±0.075mm |
◆ Irregularly shaped holes | ||
| Knife shaped | Special knives: 82 °, 90 °, 120 °, 135 ° (cone hole drill diameter range 0.3-10mm) | Special knives: 82 °, 90 °, 120 °, 135 ° (cone hole drill diameter range 0.3-10mm) |
| Cone shaped hole, stepped hole angle and diameter | Ordinary knife: angle 130 ° (drill diameter ≤ 3.175mm), 165 ° (drill diameter 3.175-6.3mm) | Ordinary knife: angle 130 ° (drill diameter ≤ 3.175mm), 165 ° (drill diameter 3.175-6.3mm) |
| Ladder and cone hole angle tolerance | ±10° | ±10° |
| Diameter tolerance of stepped and tapered hole openings | ±0.15mm | ±0.15mm |
| Depth tolerance of stairs and tapered holes | ±0.10mm | ±0.15mm |
| Irregular slot tolerance (milling hole) | ±0.10mm | ±0.13mm |
| Depth accuracy of controlled depth milling groove (edge) (NPTH) | ±0.10mm | ±0.10mm |
| Minimum tolerance for drilling slot holes | NPTH slot: When the slot length/width is ≥ 2, the tolerance in both the slot length and width directions is ± 0.05mm; | NPTH slot: When the slot length/width is ≥ 2, the tolerance in both the slot length and width directions is ± 0.05mm; |
| Minimum tolerance for milling slot holes | PTH slot: When the slot length/width is ≥ 2, the tolerance in both the slot length and width directions is ± 0.075mm; when 2<slot length/width ≤ 1.5, the tolerance in both the slot length and width directions is ± 0.1mm | PTH slot: When the slot length/width is ≥ 2, the tolerance in both the slot length and width directions is ± 0.075mm; when 2<slot length/width ≤ 1.5, the tolerance in both the slot length and width directions is ± 0.1mm |
| NPTH: slot width and slot length direction are both ± 0.10mm; PTH: slot width and slot length direction are both ± 0.13mm | NPTH: slot width and slot length direction are both ± 0.10mm; PTH: slot width and slot length direction are both ± 0.13mm | |
| The smallest size of the inner and outer solder pads in the laser hole | 10mil (corresponding to 4mil laser hole), 11mil (corresponding to 5mil laser hole) | 10mil (corresponding to 4mil laser hole), 11mil (corresponding to 5mil laser hole) |
| Minimum size of inner and outer solder pads in mechanical via holes | 14mil (8mil borehole) | 16mil (8mil borehole) |
◆ Pads (rings) | ||
| BGA solder pad diameter minimum | 6mil | 8mil (7mil for nickel gold plating process) |
| Pad tolerance | ±0.05mm | +/-1.5mil (solder pad ≤ 10mil); +/-10% (solder pad>10 mil) |
◆ Line width/line spacing capability | ||
| inner layer | 1/3oz、1/2oz：2.5/2.5mil | 1/3oz、1/2oz：3/3mil |
| 1oz：3/4mil | 1oz：3/4mil | |
| 2oz：4/5mil | 2oz：4/5.5mil | |
| 3oz：5/8mil | 3oz：5/8mil | |
| 4oz：6.5/11mil | 4oz：6.5/11mil | |
| 5oz：7/13.5mil | 5oz：7/14mil | |
| 6oz：8/15.5mil | 6oz：8/16mil | |
| 7oz：9/18mil | 7oz：9/19mil | |
| 8oz：10/21mil | 8oz：10/22mil | |
| outer layer | 1/3oz：3/3mil | 1/3oz：3.5/4mil |
| 1/2oz：3.5/3.5mil | 1/2oz：3.5/4mil | |
| 1oz：3.5/3.5mil | 1oz：4/4mil | |
| 2oz：6/7mil | 2oz：6/8mil | |
| 3oz：7/10mil | 3oz：7/12mil | |
| 4oz：8/13mil | 4oz：8/13mil | |
| 5oz：9/15.5mil | 5oz：9/18mil | |
| 6oz：10/18.5mil | 6oz：10/21mil | |
| 7oz：11/22mil | 7oz：11/25mil | |
| 8oz：12/26mil | 8oz：12/29mil | |
| Line width tolerance (L) (High-frequency and high-speed boards) | L＜5mil： ±0.5mil | ≤10mil： ±1.5mil |
| 5mil≤L≤10mil ±0.8mil | 5mil≤L≤10mil ±0.8mil | |
| L＞10mil： ±1.0mil | ＞10mil： ±2mil | |
◆ Design spacing | ||
| Minimum distance from mechanically drilled hole to conductor (mechanically buried blind hole plate and second-order laser buried blind hole) | 7mil (single lamination), 8mil (double lamination), 9mil (triple lamination) | 8mil (single lamination), 9mil (double or triple lamination) |
◆ Other types of design spacing | ||
| Minimum distance from mechanically drilled hole to conductor (non-buried blind via and first-order laser blind via) | 5.5mil(≤8层)，6.5mil(10-14层)，7mil(＞14层) | 7mil（≤8层），8mil（＞8层） |
| Minimum distance from laser drilled hole to conductor (first and second order HDI boards) | 5mil | 5mil |
| Minimum distance for outer layer traces without exposed copper after milling | 8mil | 9mil |
| V-CUT centerline without exposed copper to inner and outer layer circuit diagram (H indicates board thickness) | 1.0< H≤1.6mm：0.36mm（20°），0.4mm（30°），0.5mm（45°） | 1.0< H≤1.6mm：0.36mm（20°），0.4mm（30°），0.5mm（45°） |
| 1.6< H≤2.4mm：0.42mm（20°），0.51mm（30°），0.64mm（45°） | 1.6< H≤2.4mm：0.42mm（20°），0.51mm（30°），0.64mm（45°） | |
| 2.4≤H≤3.0mm：0.47mm（20°），0.59mm（30°），0.77mm（45°） | 2.4≤H≤3.0mm：0.47mm（20°），0.59mm（30°），0.77mm（45°） | |
| Minimum width of inner layer isolation band | 8mil | 8mil |
| Minimum distance of inner layer traces without exposed copper during milling | 10mil | 10mil |
| Minimum distance of gold finger chamfering without damaging the tab | 6mm | 6mm |
| Minimum spacing between the walls of identical mesh vias | 6mil (through-hole, laser-drilled blind via), 8mil (mechanically sealed blind via) | 6mil (through via, laser-drilled blind via), 8mil (mechanically sealed blind via) |
| Minimum spacing of electroless nickel-gold pads | 3.5mil (corresponding to 12um and 18um base copper) | 4mil (corresponding to 12um and 18um base copper) |
| Minimum spacing between gold fingers | 5mil | 6mil |
| Minimum spacing of solder paste pads (without solder mask) | 7mil (10mil isolation pads within large copper foil) | 7mil (10mil isolation pads within large copper foil) |
| Minimum isolation between blue glue and pads | 14mil | 16mil |
| Minimum isolation between characters and pads | 5mil (silk screen printing), 4mil (printing process) | 6mil (silk screen printing) |
| Minimum isolation between carbon inks | 13mil | 15mil |
◆ Special Substrate Metal Substrate | ||
| Metal Substrate – Number of Layers | 1-8 layers (aluminum substrate, copper substrate); 2-24 layers (cold plate, sintered plate, buried metal plate) | 1-8 layers (aluminum substrate, copper substrate); 2-24 layers (cold plate, sintered plate, buried metal plate) |
| Metal Substrate – Finished Product Size Range | MAX: 610 * 610mm, MIN: 5 * 5mm (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) | MAX: 610 * 610mm, MIN: 5 * 5mm (aluminum substrate, copper substrate, cold plate, sintered plate, buried metal plate) |
| Metal Substrate – Finished Product Thickness Range | 0.5-5.0mm | 0.5-5.0mm |
| Metal Substrate – Copper Thickness Range | 0.5-10oz | 0.5-8oz |
| Metal Substrate – Metal Base Thickness | 0.5-5.0mm | 0.5-5.0mm |
| Metal Substrate – Metal Base Material | Aluminum: 1100/1050/2124/3003/4045/5052/6061; Copper: Purple copper; Pure iron, stainless steel | Aluminum: 1100/3003/4045/5052/6061; Copper: Purple copper; pure iron |
◆ Type | ||
| Metal Substrate – Minimum Finished Hole Diameter and Tolerances | NPTH: 0.5 ± 0.05mm; PTH: 1.0 ± 0.10mm (aluminum substrate, copper substrate), 0.2 ± 0.10mm (cold plate, sintered plate, buried metal plate) | NPTH: 0.5 ± 0.05mm; PTH: 1.0 ± 0.10mm (aluminum substrate, copper substrate), 0.2 ± 0.10mm (cold plate, sintered plate, buried metal plate) |
| Metal Machining Dimensional Accuracy (Including Blind Slot Depth Control Accuracy) | ±0.03mm | ±0.05mm |
| Metal Substrate – PCB Surface Treatment | Lead free tin spraying; OSP； Sinking nickel (palladium) gold; Electric (nickel) soft/hard gold; Electroplating tin | Lead free tin spraying; OSP； Sinking nickel (palladium) gold; Electric (nickel) soft/hard gold; Electroplating tin |
| Metal Substrate – Metal Surface Treatment | Copper: Nickel plated gold; Aluminum: anodizing, hard oxidation, chemical passivation; Mechanical processing: sandblasting, wire drawing | Copper: Nickel plated gold; Aluminum: anodizing, hard oxidation, chemical passivation; Mechanical processing: sandblasting, wire drawing |
| Metal Substrate – Metal Base Material | Quanbao (T-110, T-111), Tenghui (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Biggs (MP06503, HT04503), TACONIC (TLY-5, TLY-5F) | Quanbao (T-110, T-111), Tenghui (VT-4A1, VT-4A2, VT-4A3), Laird (1KA04, 1KA06); Biggs (MP06503, HT04503), TACONIC (TLY-5, TLY-5F) |
| Metal Substrate – Thermal Conductivity | 0.3-3w w/m.k (cold plate, aluminum substrate, copper substrate); 8.33 w/m.k (sintered plate); 0.35-30w/m.k (buried metal plate), 280w/m.k (thermoelectric separation plate) | 0.3-3w w/m.k (cold plate, aluminum substrate, copper substrate); 8.33 w/m.k (sintered plate); 0.35-30w/m.k (buried metal plate) |
| Metal Substrate – Thermal Adhesive Thickness (Dielectric Layer) | 75/100/125/150/200/250um | 75/100/125/150/200/250um |
| Metal Substrate – Embedded Copper Block Dimensions | 3*3mm-70*80mm | 3*3mm-70*80mm |
| Metal Substrate – Embedded Copper Block Drop Accuracy | ±40um | ±40um |
| Metal Substrate – Distance from Embedded Copper Block to Hole Wall | ≥12mil | ≥12mil |
◆ Specialty ceramic substrates | ||
| Ceramic Substrate – Number of Layers | 1-2 layers | 1-2 layers |
| Ceramic Substrate – Finished Size Range | MAX: 140*140mm, MIN: 5*5mm | MAX: 100*100mm, MIN: 5*5mm |
| Ceramic Substrate – Surface Treatment of Metal Parts | OSP, Immersion Gold, Immersion Silver, Immersion Tin, Electroless Nickel Palladium Gold | OSP, Immersion Gold, Immersion Silver |
| Ceramic Substrate – Ceramic Plate Dielectric Thickness | 0.2, 0.25, 0.3, 0.381, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5mm | 0.2, 0.25, 0.3, 0.381, 0.5, 0.635, 0.8, 1.0, 1.2, 1.5mm |
| Ceramic Substrate – Ceramic Plate Copper Thickness | 35, 60, 150um and above | 35, 60, 150um and above |
| Ceramic Substrate – Ceramic Plate Material | Ceramic TLCC, HTCC, DBC, DPC materials (ALN and Al2O3) | Ceramic TLCC, HTCC, DBC, DPC materials (AlN and Al2O3) |
| Ceramic Substrate – Thermal Conductivity | 24-220w/m.k | 24-220 W/m.k |
◆ Other design parameters | ||
| Minimum inner layer thickness | 0.05mm (non buried blind hole plate), 0.13mm (with buried blind hole drilling) | 0.075mm (non buried blind hole plate), 0.13mm (with buried blind hole drilling) |
| Number of layers | Floors 1-40 | Floors 1-32 |
| Board thickness range | 0.2-7.0mm | 0.45-6.0mm |
| Minimum finished size | 2*2mm | 10*10mm |
| Maximum finished size | ≤ 2 layers: 26 * 45 inches; ≥ 3 layers: 25.5 * 38 inches | ≤ 2 layers: 26 * 45 inches; ≥ 3 layers: 25.5 * 38 inches |
| Layer-to-layer alignment accuracy | ≤ 4mil (below 8 layers) | ≤ 5ml (below 8 floors) |
| Plate thickness tolerance | Plate thickness ≤ 1.0mm: ± 0.1mm | Plate thickness ≤ 1.0mm: ± 0.1mm |
| Plate thickness>1.0mm: ± 10% | Plate thickness>1.0mm: ± 10% | |
| Special tolerance requirements for plate thickness (without interlayer structural requirements): ± 0.1mm for ≤ 2.0mm plates; ± 0.15mm for 2.1-3.0mm plates;+/-0.25mm for 3.1-7.0mm plates | Special tolerance requirements for plate thickness (without interlayer structural requirements): ± 0.13mm for ≤ 2.0mm plates; ± 0.15mm for 2.1-3.0mm plates;+/-0.3mm for 3.1-6.0mm plates | |
| Impedance tolerance | Single ended: ± 5 ohms (≤ 50 ohms), ± 10% (>50 ohms) (ultimate capability, ± 5% (≥ 50 ohms)); Difference: ± 5 ohms (≤ 50 ohms), ± 10% (>50 ohms) (ultimate ability, ± 5%) | ±5Ω（<50Ω），±10%（≥50Ω） |
| Dimensional tolerances | ±0.05mm | ±0.1mm |
| Positional tolerances | ±0.075mm | ±0.1mm |
| Maximum allowable warpage | 0.50% | 0.75% |
| Maximum copper thickness of inner and outer layers | Inner layer: 8oz; Outer layer: 8oz | Inner layer: 4oz; Outer layer: 6oz |
| Minimum insulation layer thickness | 2mil (limited to H0Z based copper) | 2mil (limited to H0Z based copper) |
| Minimum character line width and height | Line width 4mil, height 23mil (12um, 18um base copper); Line width of 5mil, height of 30mil (35um copper base); Line width 6mil, height 45mil (70um copper base) | Line width 4mil, height 23mil (12um, 18um base copper); Line width of 5mil, height of 30mil (35um copper base); Line width 6mil, height 45mil (70um copper base) |
| Minimum inner corner radius | 0.3mm | 0.3mm |
| V-cut angle tolerance | ±5° | ±5° |
| V-cut symmetry tolerance | ±4mil | ±4mil |
| V-cut rib thickness tolerance | ±4mil | ±4mil |
| V-cut board thickness range | Substrate thickness (excluding outer copper) ≥ 0.4mm, finished board thickness ≤ 3.2mm, substrate thickness ≤ 0.6mm. It is recommended to perform single-sided V-cut first | Substrate thickness (excluding outer copper) ≥ 0.4mm, finished board thickness ≤ 3.2mm, substrate thickness ≤ 0.6mm. It is recommended to perform single-sided V-cut first |
| Outline type | Milling shape; V-CUT； Bridge connection; stamp hole | Milling shape; V-CUT； Bridge connection; stamp hole |
| Minimum solder mask bridge width | When the bottom copper is ≤ 1oz: 4mil (green); 5ml (other colors); 6mil (solder bridge on large copper surface) | When the bottom copper is ≤ 1oz: 4mil (green); 5ml (other colors); 6mil (solder bridge on large copper surface) |
| When the bottom copper is 2-4oz: 20mil; | When the bottom copper is 2-4oz: 20mil; 8mil | |
| Solder mask opening minimum width (single side) | 2mil (allowing local 1.5mil) | 2mil |
| Minimum distance between solder mask opening and trace | 3mil | 3mil |
| Minimum distance between solder mask opening and non-plated hole | 6mil | 7mil |
| Solder mask ink color | Green (matte), yellow, black (matte), blue, red, white, purple, transparent | Green (matte), yellow, black (matte), blue, red, white, purple, transparent |
| Character ink color | White, yellow, black | White, yellow, black |
| Gold finger chamfer angle tolerance | ±5° | ±5° |
| Gold finger chamfer remaining thickness tolerance | ±5mil | ±5mil |
| Minimum test conduction resistance | 10 ohms (four wire test: 0.3m Ω) | 10 ohms (four wire test: 0.3m Ω) |
| Maximum test insulation resistance | 100 MΩ | 100 MΩ |
| Maximum test voltage | 300V | 300V |
